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SikaBond-54 Wood Floor Adhesive 13kg

Our Price:
£84.95 £101.94 inc VAT
RRP:
£122.18
£146.62 inc VAT

SikaBond-54 Wood Floor is a professional wood floor adhesive that is fast curing, solvent-free and elastic. For full stick bonding of both solid and engineered wood floors. It is also suitable for use with sub-floor heating systems.

SikaBond-54 Wood Floor

 

Product Description

Low viscosity, solvent free elastic adhesive for wood flooring. SikaBond -54 Wood Floor is a one component, fast curing, solvent free, elastic adhesive for full surface bonding.

 

Uses

With SikaBond -54 Wood Floor:

  • Solid and engineered wood floors (strips, longstrips, planks, panels, boards), mosaic parquet, industrial parquet, lam parquet, wood paving (residential) as well as chip boards, plywood and OSB can be bonded

 

Characteristics / Advantages

  • Solid and engineered wood floors (strips, longstrips, planks, panels, boards), mosaic parquet, industrial parquet, lam parquet, wood paving (residential) as well as chip boards, plywood and OSB can be bonded
  • 1-component, ready to use
  • Fast curing properties
  • Excellent workability
  • Floor can be sanded after 12 hrs (+23°C / 50% r. h. Trowel B3 / B11)
  • Suitable for most common types of wood floors
  • Especially suitable for problematic woods such as beech, maple and bamboo
  • Suitable for bonding wood floors directly onto old ceramic tiles
  • Reduces stress to the substrate: the elastic adhesive reduces stress transfer between the wood floor and the substrate
  • Suitable for use with sub floor heating
  • Adhesive can be sanded

 

Specific Characteristics

  • Solventfree
  • Odourless
  • Recyclable tin pail

 

Specific Approvals/Standards

EMICODE EC 1 PLUS

R, very low emission

 

Consumption / Dosage

Full Surface Bonding:

600-700g/m withnotchedtrowelB3(acc.toIVKguidelines)(e.g.lamparquet, mosaic parquet and industrial parquet).

600-800g/m withnotchedtrowelB6(=P4)(acc.toIVKguidelines)or /16" /8" /8"(engineered strips / planks, lam parquet, mosaic parquet).

600-900g/m withnotchedtrowelB11(=P6)(acc.toIVKguidelines),AP48or 333 /16" /16" /16"(solidwood,engineeredlong-strips/panels,industrialparquet,wood paving (residential), chipboards).

For bonding of long or wide boards or with uneven substrates it may be necessary to use a notched trowel with bigger notches (to prevent hollow sections).

For substrates primed with SikaBond Rapid DPM or Sika Primer MB, the consumption of SikaBond -54 Wood Floor is reduced.

 

Substrate Quality

Clean and dry, homogeneous, even, free from grease, dust and loose particles. Paint, laitance and other poorly adhering particles must be removed.

Standard construction rules must be observed.

 

Substrate Preparation

Concrete / cement screed: Must be ground and thoroughly cleaned with industrial vacuum cleaner.

Anhydrite screed / Anhydrite flowable screed: Must be ground and thoroughly cleaned with industrial vacuum cleaner shortly before bonding starts.

Broadcast mastic asphalt: Must be primed with SikaBond Rapid DPM or Sika Primer MB. Instructions for use, see Product Data Sheet for Sika Primer MB.

Glazed ceramic and old ceramic tiles: Degrease, clean with SikaCleaner thoroughly. or grind the tile surfaces and vacuum

Wood / gypsum boards (e.g. chipboards, plywood): Glue / screw the boards to the substructure. They must be fixed to the substrate. For floating sub floors, please contact our Technical Department.

Other substrates:

Please contact our Technical Department for advice and assistance.

SikaBond-54 Wood Floor can be used without priming on cementitious floors, anhydrite floors, chipboards, concrete and ceramic tiles.

For broadcast mastic asphalt, cementitious floors with excessive moisture content DPM or Sika Rapid Primer MB. For detailed instructions consult the Product Data Sheet and for use over old adhesive residues or on weak substrates use SikaBond Primer MB or contact our Technical Department.

 

Substrate Temperature

During laying and until SikaBond -54 Wood Floor has fully cured the substrate and ambient temperatures should be > +15°C and with flo or heating < +20°C. For substrate temperatures the standard construction rules are relevant. Ambient temperature between

 

Ambient Temperature

Ambient temperature between +15°C and +35°C.

For ambient temperatures the standard construction rules are relevant.

 

Substrate Moisture Content

Permissible substrate moisture content:

- 2.5% CM for cement screed (ca. 4% Tramex / Gravimetric weight percent).

- 0.5% CM for anhydrite screed.

- 3 - 12% CM for magnesite flooring (dependent on proportion of organic components).

Permissible substrate moisture content for use with under floor heating:

- 1.8% CM for cement screed (ca. 3% Tramex / Gravimetric weight percent).

- 0.3% CM for anhydrite screed.

- 3 - 12% CM for magnesite flooring (dependent on the proportion of organic components).

For moisture contents and the quality of substrates the guidelines of the wood floor manufacturer as well as standard construction rules must be observed.

 

Relative Air Humidity

Between 40% and 70%.

 

Application Method / Tools

SikaBond -54 Wood Floor is applied to the properly prepared substrate directly from the pail and uniformly distributed by notched trowel.

Press the wood floor pieces firmly into the adhesive so that the wood floor underside is fully wetted. The pieces can then be joined together using a hammer and an impact block. Many types of wood floors have to be tapped from the top. A distance of 10 - 15 mm from the wall to the wood floor must be observed.

Fresh, uncured adhesive remaining on the wood floor surface must be removed immediately with a clean cloth and if necessary cleaned with Sika Remover-208 or Sika Wipes. Test wood floor surfaces for compatibility with Sika Remover-208 before use.

The laying instructions of the wood floor manufacturer as well as standard construction rules must be observed.